SAC305 solder bar lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure™ process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.

Features of SAC305
* Melting Point 220°C (428°F)
* Compatible with all Flux Types
* Excellent wetting speed
* Excellent solderability and spreading
* Reduced bridging versus Sn-Cu alloys
* Manufactured with AIM Electropure™ Technology

Handling and Storage
SAC305 solder bars have a shelf life of 7 years when stored at room temperature

Flux Compatibility
SAC305 bar solder is compatible with all major brands of no-clean and water soluble electronic grade fluxes

Availability
* Bar Solder
* Wire Solder
* Solder Paste

Complies with IPC J-STD-006