M8 no clean solder paste brings performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders. M8provides a stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads. M8 passes stringent automotive and high reliability SIR and electrochemical test requirements. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

Features
* Low Voiding: <5% on BGA and <10% on BTC
* Excellent Print Transfer Efficiencies <0.50 AR
* Eliminates HiP Defects
* REACH and RoHS Compliant for Lead-Free alloys
* Formulated for use with T4 and Finer Powders
* Powerful Wetting on Lead-Free Surface Finishes
* Minimal Transparent Residue – LED Compliant
* Passes Bono and Automotive SIR Testing

Cleaning
Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW-10 will not dry M8 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse.
Post-Reflow Flux Residue: M8 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that M8 residues can be effectively removed with common defluxing agents.

Handling and Storage
Sealed Refrigerated Shelf Life is one year when store at 0°C-12°C (32°F-55°F)
Sealed Unrefrigerated Shelf Life is 3 months when stored at <25°C (<77°F)
Do not add used paste to unused paste. Store used paste separately; keep unused paste tightly sealed with internal plug or end cap in place. After opening, solder paste shelf life is environment and application dependent. Alloy and storage conditions may affect shelf life.