NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NS257-2 was developed for use in air reflow, but can be used in both N² and vapor-phase reflow processes as well. NC257-2 is formulated to extend print performance and tack time in facilities where environmental control is not at its optimum.

Features
* RoHS Compliant
* Halogen Free
* Reduces Voiding Under Micro-BGAs
* Excellent Wetting
* Mitigates Head-in-Pillow Defects
* Pin Testable Residues

Cleaning
Pre-Reflow: AIM DJAW-10 effectivley removes NC257-2 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse.
Post-Reflow Flux Residue: NC257-2 residue can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that NC257-2 residues can be effectively removed with common defluxing agents.