NC257-2 improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. NC257-2 prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.
NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts. AND the thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in-pillow. Contact AIM to request more information and a sample of NC257-2 in one of our many lead-free alloys, including 63/36 and 62/36/2 Alloys.
Eliminates Head-in-Pillow and Voiding Bright and Shiny Solder Joints Excellent Printing and Reflow Characteristics No Silver Excellent Wetting Low-Tombstoning 24 Hour Stencil Life Low-Solder Beading 12-14 Hour Tack Time Broad Printing Process Window Clear Pin-Probe Testable Residue Available in Industry Standard Sizes.