NC254 Flux Paste is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC254 Flux Paste may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. The superior wetting ability of NC254 FLux Paste results in bright, smooth and shiny solder joints whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit test. NC254 FLux Paste is compatible with all tin-lead and lead-free alloys and is suitable for a wide range of applications. NC254 Flux Paste can beb rushed, dispensed, pin transferred, or stencil printed.
* Excellent wetting
* Wide process wetting
* Tin-lead and Lead-free compatible
* Use for ball attachy
* When being used in reworkk, application should be limited to the area being worked
* Application via dispanse needle, brush or cotton swab is recommended
* NC254 Flux Paste needs to see an SMT style relfow profile to render it fully inactive
NC254 Flux Paste can be cleaned, if necessary, with saponified water or an appropriate solvent cleaner.
Handeling & Storage
NC254 Flux Paste has a refrigerated shelf life of 1 year at 4°C (40°F) to 12°C (55°F), and 6 months at room temperature. Allow the flux paste to warm up completely and naturally to ambient temperature (2hours) prior to use. Do not store new and used flux paste in the same container.
Use with adequate ventilation and proper personal protective equiptment. Refer to the accompanying Material Safety Data Sheet for any specific emergency information. Do not dispose of any hazardous materials in non-approved containers.